JPH073311Y2 - 半導体差圧測定装置 - Google Patents
半導体差圧測定装置Info
- Publication number
- JPH073311Y2 JPH073311Y2 JP14041588U JP14041588U JPH073311Y2 JP H073311 Y2 JPH073311 Y2 JP H073311Y2 JP 14041588 U JP14041588 U JP 14041588U JP 14041588 U JP14041588 U JP 14041588U JP H073311 Y2 JPH073311 Y2 JP H073311Y2
- Authority
- JP
- Japan
- Prior art keywords
- sensor chip
- semiconductor
- diaphragm
- liquid contact
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 44
- 238000005259 measurement Methods 0.000 claims description 29
- 239000007788 liquid Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14041588U JPH073311Y2 (ja) | 1988-10-27 | 1988-10-27 | 半導体差圧測定装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14041588U JPH073311Y2 (ja) | 1988-10-27 | 1988-10-27 | 半導体差圧測定装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0260838U JPH0260838U (en]) | 1990-05-07 |
| JPH073311Y2 true JPH073311Y2 (ja) | 1995-01-30 |
Family
ID=31404562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14041588U Expired - Lifetime JPH073311Y2 (ja) | 1988-10-27 | 1988-10-27 | 半導体差圧測定装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073311Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016003994A (ja) * | 2014-06-18 | 2016-01-12 | セイコーエプソン株式会社 | 物理量センサー、高度計、電子機器および移動体 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005027365A1 (de) * | 2005-06-14 | 2006-12-21 | Robert Bosch Gmbh | Hochdrucksensoreinrichtung und Verfahren zu ihrer Herstellung |
| DE102008021091A1 (de) * | 2008-04-28 | 2009-10-29 | Epcos Ag | Drucksensor |
-
1988
- 1988-10-27 JP JP14041588U patent/JPH073311Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016003994A (ja) * | 2014-06-18 | 2016-01-12 | セイコーエプソン株式会社 | 物理量センサー、高度計、電子機器および移動体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0260838U (en]) | 1990-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5937716Y2 (ja) | 半導体差圧センサ | |
| CN103477199B (zh) | 耐压封装的压差传感器 | |
| US4023562A (en) | Miniature pressure transducer for medical use and assembly method | |
| JPS6153876B2 (en]) | ||
| CN111638002B (zh) | 一种mems压力传感器充油芯体及其封装方法 | |
| JPH04320938A (ja) | 差圧センサ、及び複合機能形差圧センサ | |
| EP0890830A1 (en) | Pressure sensor | |
| US4809555A (en) | Pressure sensor | |
| US4498070A (en) | Semi-conductor transducer and method of making the same | |
| JPH073311Y2 (ja) | 半導体差圧測定装置 | |
| JPH11304612A (ja) | 半導体圧力検出装置 | |
| JPH01169333A (ja) | 半導体圧力変換器 | |
| CN214251349U (zh) | 基于封装基板的阵列式压力测量装置 | |
| CN211717678U (zh) | 一种基于纳米孔的石墨烯高压压力传感器 | |
| JPH02196938A (ja) | 圧力センサ | |
| JPH1194673A (ja) | センサおよびセンサの製造方法 | |
| JP3307275B2 (ja) | 半導体圧力センサ | |
| JP3158354B2 (ja) | 圧力検出装置 | |
| CN222812487U (zh) | 压力传感器、压力传感装置及电子设备 | |
| JP3627036B2 (ja) | 半導体圧力センサ | |
| JP3375533B2 (ja) | 半導体圧力変換器 | |
| JPS59174728A (ja) | 半導体式圧力センサ | |
| JP2735107B2 (ja) | 半導体圧力センサ | |
| JPH04350530A (ja) | 半導体圧力センサ | |
| JP3307274B2 (ja) | 半導体圧力センサ |